The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Sep. 07, 2018
Intel Corporation, Santa Clara, CA (US);
Mauro J. Kobrinsky, Portland, OR (US);
Myra McDonnell, Portland, OR (US);
Brennen K. Mueller, Portland, OR (US);
Chytra Pawashe, Beaverton, OR (US);
Daniel Pantuso, Portland, OR (US);
Paul B. Fischer, Portland, OR (US);
Lance C. Hibbeler, Tillamook, OR (US);
Martin Weiss, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Techniques and mechanisms for forming a bond between two wafers. In an embodiment, a first wafer and a second wafer are positioned with respective wafer holders, and are deformed to form a first deformation of the first wafer and a second deformation of the second wafer. The first deformation and the second deformation are symmetrical with respect to a centerline which is between the first wafer and the second wafer. A portion of the first deformation is made to contact, and form a bond with, another portion of the second deformation. The bond is propagated along respective surfaces of the wafers to form a coupling therebetween. In another embodiment, one of the wafer holders comprises one of an array of elements to locally heat or cool a wafer, or an array of displacement stages to locally deform said wafer.