Company Filing History:
Years Active: 2020
Title: Innovations of Lance C. Hibbeler in Wafer Bonding Technology
Introduction: Lance C. Hibbeler is an accomplished inventor based in Tillamook, Oregon. He is known for his significant contributions to the field of semiconductor technology, particularly in wafer bonding techniques. His innovative approach has led to advancements that enhance the efficiency and effectiveness of wafer bonding processes.
Latest Patents: Hibbeler holds a patent for "Wafer to wafer bonding with low wafer distortion." This patent describes techniques and mechanisms for forming a bond between two wafers. In his invention, a first wafer and a second wafer are positioned with respective wafer holders and are deformed to create symmetrical deformations. The bond is formed by making contact between portions of these deformations, which is propagated along the surfaces of the wafers to establish a coupling. Additionally, one of the wafer holders may include an array of elements for local heating or cooling, or displacement stages for local deformation of the wafer.
Career Highlights: Hibbeler is currently employed at Intel Corporation, where he applies his expertise in semiconductor technology. His work at Intel has allowed him to be at the forefront of innovations in the industry. He has made significant contributions that have improved the manufacturing processes of semiconductor devices.
Collaborations: Throughout his career, Hibbeler has collaborated with notable colleagues, including Mauro J. Kobrinsky and Myra McDonnell. These collaborations have fostered an environment of innovation and have led to the development of advanced technologies in the semiconductor field.
Conclusion: Lance C. Hibbeler's contributions to wafer bonding technology exemplify the spirit of innovation in the semiconductor industry. His patent and work at Intel Corporation highlight his commitment to advancing technology and improving manufacturing processes.