Intel Corporation

Lance C Hibbeler

Paul B Fischer

Mauro J Kobrinsky

Brennen Karl Mueller

Chytra Pawashe

Daniel Pantuso

Martin Weiss

Myra McDonnell

Techniques and mechanisms for forming a bond between two wafers. In an embodiment, a first wafer and a second wafer are positioned with respective wafer holders, and are deformed to form a first deformation of the first wafer and a second deformation of the second wafer. The first deformation and the second deformation are symmetrical with respect to a centerline which is between the first wafer and the second wafer. A portion of the first deformation is made to contact, and form a bond with, another portion of the second deformation. The bond is propagated along respective surfaces of the wafers to form a coupling therebetween. In another embodiment, one of the wafer holders comprises one of an array of elements to locally heat or cool a wafer, or an array of displacement stages to locally deform said wafer.

Wafer to wafer bonding with low wafer distortion

Growing community of inventors

Tillamook, OR, United States of America

Lance C Hibbeler