This inventor holds 3 USPTO granted patents. Top assignee: Towa Corporation. Active years: 2008-2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Singapore, SG (2008)
- Kyoto, JP (2017)
Company Filing History:
Years Active: 2008-2017
Title: Muneo Miura: Innovator in Electronic Component Production
Introduction
Muneo Miura is a distinguished inventor based in Kyoto, Japan. He has made significant contributions to the field of electronic components, holding a total of 3 patents. His innovative methods focus on enhancing the production of resin-encapsulated electronic components.
Latest Patents
Miura's latest patents include a method for producing resin-encapsulated electronic components, a bump-formed plate-like member, and a method for producing bump-formed plate-like members. These inventions provide efficient techniques for creating electronic components that integrate via electrodes and plate-like members. The methods involve encapsulating electronic components in resin, ensuring that the components are securely connected to wiring patterns.
Career Highlights
Throughout his career, Miura has been associated with Towa Corporation, where he has played a pivotal role in advancing electronic component technology. His work has been instrumental in developing methods that simplify the production process while maintaining high-quality standards.
Collaborations
Miura has collaborated with notable colleagues, including Hirokazu Okada and Hiroshi Uragami. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Muneo Miura's contributions to the field of electronic components are noteworthy. His innovative patents and collaborative efforts continue to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile