The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Jul. 14, 2005
Tomoya Shimonaka, Kyoto, JP;
Muneo Miura, Singapore, SG;
Andrew Ong Soon Lee, Singapore, SG;
Towa Corporation, Kyoto, JP;
Abstract
According to a resin encapsulation molding method for a semiconductor device, a resin-encapsulated substrate having a semiconductor device that is mounted on the substrate and that has a portion exposed is formed. With the method, a device-mounted substrate on which the semiconductor device is mounted is prepared and then the device-mounted substrate is set in one mold part. A release film is thereafter provided between the device-mounted substrate and the other mold part opposite to that one mold part. The one and other mold parts are then closed to press the release film against the portion of the semiconductor device. The device-mounted substrate has a projection enclosing the portion of the semiconductor device for preventing resin flash from being formed. When the mold parts are closed, the release film is pressed against the projection to allow the projection to dig into the release film.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile