The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Dec. 23, 2014
Towa Corporation, Kyoto-shi, Kyoto, JP;
Hirokazu Okada, Kyoto, JP;
Hiroshi Uragami, Kyoto, JP;
Tsuyoshi Amakawa, Kyoto, JP;
Muneo Miura, Kyoto, JP;
TOWA CORPORATION, Kyoto-shi, Kyoto, JP;
Abstract
The present invention provides a method for producing a resin-encapsulated electronic component, capable of simply and efficiently producing a resin-encapsulated electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method includes a resin-encapsulation step of encapsulating at least one electronic component in a resin. A produced resin-encapsulated electronic component includes: a substrate; the at least one electronic component; the resin; a plate-like member; and at least one bump. A wiring pattern is formed on the substrate. In the resin-encapsulation step, between a bump-formed surface in a bump-formed plate-like member obtained by forming the at least one bump in the plate-like member and a wiring pattern-formed surface in the substrate, the at least one electronic component is encapsulated in the resin, and the at least one bump is caused to be in contact with the wiring pattern.