Nirasaki, Japan

Mitsuhiro Okada

This inventor holds 83 USPTO granted patents and 8 published patent applications and 5 EPO patents, primarily in Semiconductor Manufacturing (CPC class H01L21-02532). Top assignees: Tokyo Electron Limited, Adeka Corporation, Hitachi, Ltd.. Active years: 2007-2024.

USPTO Granted Patents = 83 

% Patents Active = 78.3

 

Average Co-Inventor Count = 2.6

ph-index = 7

Forward Citations = 652(Granted Patents)

Forward Citations (Not Self Cited) = 621(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Tokyo-To, JP (2008 - 2010)
  • Sagamihara, JP (2012)
  • Kai, JP (2008 - 2013)
  • Yokohama, JP (2013 - 2016)
  • Niraski, JP (2016)
  • Yamanashi, JP (2010 - 2022)
  • Tokyo, JP (2007 - 2023)
  • Nirasaki, JP (2010 - 2023)
  • Nirasaki Yamanashi, JP (2023)

Company Filing History:


Years Active: 2007-2024

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Areas of Expertise:
Silicon Film Forming
Substrate Processing
Motion Evaluation
Heat Treatment
Data Processing
Encoding Method
Storage Apparatus
Vertical Processing
Thin Film Formation
Photoelectric Conversion
Amorphous Silicon
Boron-Doped Silicon
83 patents (USPTO):Explore Patents

Title: Mitsuhiro Okada: Innovator in Semiconductor Manufacturing

Introduction

Mitsuhiro Okada, based in Nirasaki, Japan, is a prominent inventor in the field of semiconductor technology. With an impressive portfolio of 83 patents, he has made significant contributions to the advancement of manufacturing processes and equipment used in the semiconductor industry.

Latest Patents

Among his recent innovations is a patented Method of Manufacturing Semiconductor Device. This method involves planarizing a substrate surface to expose a conductive material embedded in a predefined hole. The technique incorporates several steps, including laminating a mask film, forming a second hole in the mask, and embedding conductive material, ultimately enhancing the efficiency and quality of semiconductor devices.

Another noteworthy patent is the Substrate Processing Method and Substrate Processing Apparatus. This patent describes a substrate processing method that includes a cyclical process of supplying source and reaction gases, which improves the accuracy and reliability of substrate processing. The method is designed to optimize gas flow and pressure dynamics within processing equipment, which is critical for modern semiconductor fabrication.

Career Highlights

Mitsuhiro Okada has worked with renowned companies in the technology sector, including Tokyo Electron Limited and Hitachi, Ltd. His experiences at these organizations have provided him with valuable insights into the latest advancements in semiconductor technologies and engineering practices.

Collaborations

Throughout his career, Okada has collaborated with remarkable colleagues, including Kazuhide Hasebe and Akifumi Suzuki. These partnerships have not only bolstered his research initiatives but also enhanced the collective goal of innovating processes and technologies within the semiconductor manufacturing landscape.

Conclusion

Mitsuhiro Okada's contributions to semiconductor manufacturing are commendable, as reflected in his extensive patent portfolio. His dedication to innovation continues to shape the future of the semiconductor industry, making him a notable figure among contemporary inventors.

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