Ming Shih Yeh

This inventor holds 28 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Shih Yeh. Retrieved from https://idiyas.com/inventor/ming-shih-yeh-usdvhgoj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 28 (Patent Applications = 6)

% Patents Active = 100.0

Average Co-Inventor Count = 5.9

ph-index = 4

Forward Citations = 42(Granted Patents)

Location History:

Hsinchu, TW (2019 - 2020)
Zhubei, TW (2018 - 2024)

Company Filing History:

28 out of 42,965

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2018-2026

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Areas of Expertise:

Semiconductor Package

Vias

Dielectric Substrate

Multi-Stacked Structures

Integrated Circuit

Dicing Method

Interconnection

Manufacturing Method

Trench Design

Terminal Connections

Package-on-Package

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12713992 - SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING (2026-08-18),

2. 12653020 - Via for semiconductor device connection (2026-06-09),

3. 12368280 - Semiconductor device and method (2025-07-22),

4. 12347749 - Semiconductor packages (2025-07-01),

5. 12211782 - Semiconductor package dielectric susbtrate including a trench (2025-01-28),

6. 12142524 - Via for component electrode connection (2024-11-12),

7. 11961800 - Via for semiconductor device connection and methods of forming the same (2024-04-16),

8. 11961796 - Semiconductor package dielectric substrate including a trench (2024-04-16),

9. 11854994 - Redistribution structure for integrated circuit package and method of forming same (2023-12-26),

10. 11728249 - Semiconductor package and method (2023-08-15),

11. 11664322 - Multi-stacked package-on-package structures (2023-05-30),

12. 11646220 - Raised via for terminal connections on different planes (2023-05-09),

13. 11469138 - Via for coupling attached component upper electrode to substrate (2022-10-11),

14. 11444034 - Redistribution structure for integrated circuit package and method of forming same (2022-09-13),

15. 11444020 - Via for semiconductor device connection and methods of forming the same (2022-09-13),

Title: The Inventor Profile of Ming Shih Yeh

Introduction: Ming Shih Yeh is a distinguished inventor hailing from Zhubei, Taiwan. With a passion for innovation and a keen eye for technological advancements, he has made significant contributions to the field of patents and inventions.

Latest Patents: Ming Shih Yeh holds several patents in various industries, ranging from electronics to healthcare. His recent patents showcase his versatility and creativity in developing cutting-edge solutions to real-world problems.

Career Highlights: Throughout his career, Ming Shih Yeh has worked with leading research institutions and companies to bring his inventions to life. His dedication to pushing the boundaries of technology has earned him recognition as a visionary in the field of innovation.

Collaborations: Ming Shih Yeh has collaborated with top engineers, scientists, and inventors on groundbreaking projects that have shaped the industry. His ability to work effectively in multidisciplinary teams has led to the successful development of revolutionary products.

Conclusion: In conclusion, Ming Shih Yeh's innovative spirit and commitment to excellence have solidified his reputation as a prominent inventor in Zhubei, Taiwan. His contributions to the world of patents and inventions continue to inspire future generations of inventors.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

6 patents pending: