IDiyas

For the Inventor, By the Inventor

Hsinchu County, Taiwan

Ming-Shih Yeh

USPTO Granted Patents = 35 

Average Co-Inventor Count = 5.2

ph-index = 8

Forward Citations = 139(Granted Patents)


Location History:

  • Chupel, TW (2012)
  • Chupei, TW (2010 - 2015)
  • Hsinchu, TW (2008 - 2020)
  • Hsinchu County, TW (2018 - 2024)

Company Filing History:

goldMedal35 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2008-2025

where 'Filed Patents' based on already Granted Patents

35 patents (USPTO):
1. 12431417 - Semiconductor package and method of manufacturing the same (2025-09-30),
2. 12341104 - Methods of manufacturing semiconductor devices (2025-06-24),
3. 12159853 - Package structure including IPD and method of forming the same (2024-12-03),
4. 12087745 - Package structure and manufacturing method thereof (2024-09-10),
5. 12062602 - Semiconductor package and method of manufacturing the same (2024-08-13),
6. 12033949 - Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure (2024-07-09),
7. 11935836 - Semiconductor devices (2024-03-19),
8. 11837587 - Package structure and manufacturing method thereof (2023-12-05),
9. 11682654 - Semiconductor structure having a sensor device and method of manufacturing the same (2023-06-20),
10. 11587900 - Package structure including IPD and method of forming the same (2023-02-21),
11. 11502032 - Chip package and method of fabricating the same (2022-11-15),
12. 11482497 - Package structure including a first die and a second die and a bridge die and method of forming the package structure (2022-10-25),
13. 11450612 - Semiconductor devices and methods of manufacturing the same (2022-09-20),
14. 11217570 - Package structure and manufacturing method thereof (2022-01-04),
15. 11201142 - Semiconductor package, package on package structure and method of froming package on package structure (2021-12-14),

Title: Innovator Profile: Ming-Shih Yeh

Introduction

Ming-Shih Yeh is a prominent inventor based in Hsinchu County, Taiwan, with a remarkable portfolio comprising 33 patents. His work primarily focuses on innovative semiconductor packaging technologies that enhance electronic device performance and reliability.

Latest Patents

Ming-Shih Yeh's latest patents include groundbreaking developments in package structures. One significant patent describes a package structure that includes Integrated Passive Devices (IPD) and a method of forming the same. This innovative packaging encompasses a die, an encapsulant that laterally encapsulates the die, and a carefully designed RDL structure complemented by an IPD and an underfill layer. The design optimally enhances electrical connections while upgrading the durability of semiconductor components.

Another noteworthy patent details a comprehensive package structure and its manufacturing method. This patent outlines a dual-package approach integrating multiple semiconductor dies, where solder joints facilitate electrical connections. The design ensures that the solder joints are optimally sized for performance, enhancing the efficacy of the overall package structure.

Career Highlights

Ming-Shih Yeh is employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading organization in the semiconductor industry. His role involves researching and developing advanced semiconductor packaging solutions, contributing significantly to the company's reputation for innovation and excellence.

Collaborations

Throughout his career, Ming-Shih has collaborated with notable coworkers, including An-Jhih Su and Der-Chyang Yeh. Their combined expertise fosters a creative environment conducive to developing advanced patentable technologies in semiconductor packaging.

Conclusion

Ming-Shih Yeh stands out as a pivotal figure in semiconductor innovation. His extensive patent portfolio reflects a commitment to advancing technology in the industry, showcasing his ingenuity and teamwork in achieving remarkable breakthroughs.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…