This inventor holds 37 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2008-2026.
Location History:
- Chupel, TW (2012)
- Chupei, TW (2010 - 2015)
- Hsinchu, TW (2008 - 2020)
- Hsinchu County, TW (2018 - 2024)
Company Filing History:
Years Active: 2008-2026
Areas of Expertise:
Title: Innovator Profile: Ming-Shih Yeh
Introduction
Ming-Shih Yeh is a prominent inventor based in Hsinchu County, Taiwan, with a remarkable portfolio comprising 33 patents. His work primarily focuses on innovative semiconductor packaging technologies that enhance electronic device performance and reliability.
Latest Patents
Ming-Shih Yeh's latest patents include groundbreaking developments in package structures. One significant patent describes a package structure that includes Integrated Passive Devices (IPD) and a method of forming the same. This innovative packaging encompasses a die, an encapsulant that laterally encapsulates the die, and a carefully designed RDL structure complemented by an IPD and an underfill layer. The design optimally enhances electrical connections while upgrading the durability of semiconductor components.
Another noteworthy patent details a comprehensive package structure and its manufacturing method. This patent outlines a dual-package approach integrating multiple semiconductor dies, where solder joints facilitate electrical connections. The design ensures that the solder joints are optimally sized for performance, enhancing the efficacy of the overall package structure.
Career Highlights
Ming-Shih Yeh is employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading organization in the semiconductor industry. His role involves researching and developing advanced semiconductor packaging solutions, contributing significantly to the company's reputation for innovation and excellence.
Collaborations
Throughout his career, Ming-Shih has collaborated with notable coworkers, including An-Jhih Su and Der-Chyang Yeh. Their combined expertise fosters a creative environment conducive to developing advanced patentable technologies in semiconductor packaging.
Conclusion
Ming-Shih Yeh stands out as a pivotal figure in semiconductor innovation. His extensive patent portfolio reflects a commitment to advancing technology in the industry, showcasing his ingenuity and teamwork in achieving remarkable breakthroughs.