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Hsinchu, Taiwan

Ming-Chia Wu

This inventor holds 9 USPTO granted patents and 1 EPO patent. Top assignee: Cyntec Company. Active years: 2017-2021.

USPTO Granted Patents = 9

% Patents Active = 100.0

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 25(Granted Patents)

Company Filing History:

Years Active: 2017-2021

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11067606 - Current sensing module (2021-07-20),

2. 10854575 - Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure (2020-12-01),

3. 10529680 - Encapsulated electronic device mounted on a redistribution layer (2020-01-07),

4. 10297573 - Three-dimensional package structure and the method to fabricate thereof (2019-05-21),

5. 10128214 - Substrate and the method to fabricate thereof (2018-11-13),

6. 9984996 - Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor (2018-05-29),

7. 9911715 - Three-dimensional package structure and the method to fabricate thereof (2018-03-06),

8. 9859250 - Substrate and the method to fabricate thereof (2018-01-02),

9. 9655253 - Method of fabrication of encapsulated electronics devices mounted on a redistribution layer (2017-05-16),

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Profile summary based on public USPTO records.

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