The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Nov. 28, 2017
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/552 (2006.01); H05K 5/02 (2006.01); H05K 5/06 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 7/02 (2006.01); H05K 7/20 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 25/50 (2013.01); H05K 1/115 (2013.01); H05K 3/42 (2013.01); H05K 5/0247 (2013.01); H05K 5/065 (2013.01); H05K 7/02 (2013.01); H05K 7/20509 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/13055 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract
The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.