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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10297573 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Jan. 22, 2018

Three-dimensional package structure and the method to fabricate thereof

Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Bau-Ru Lu, Changhua County, TW;

Ming-Chia Wu, Hsinchu, TW;

Shao Wei Lu, Hsinchu County, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorneys:

Min-Lee Teng

Litron Patent & Trademark Office

Primary Examiner:

Moin M Rahman

Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/552 (2006.01); H05K 5/02 (2006.01); H05K 5/06 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 7/02 (2006.01); H05K 7/20 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 25/50 (2013.01); H05K 1/115 (2013.01); H05K 3/42 (2013.01); H05K 5/0247 (2013.01); H05K 5/065 (2013.01); H05K 7/02 (2013.01); H05K 7/20509 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/13055 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract

A three-dimensional package structure, comprising: a substrate; a first plurality of discrete electronic components disposed over the bottom surface of the substrate, wherein a first insulating layer is disposed over the bottom surface of the substrate to encapsulate the first plurality of discrete electronic components, wherein at least one second insulating layer is disposed over the first insulating layer, wherein a plurality of surface-mount pads are disposed on the bottom surface of the at least one second insulating layer and electrically connected to at least one via disposed in the at least one second insulating layer.

Find Patent Forward Citations

Lu, Bau-Ru. (2019). Three-dimensional package structure and the method to fabricate thereof (U.S. Patent No. 10297573). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10297573

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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