Cyntec Company

Ming-Chia Wu

Bau-Ru Lu

Shao Wei Lu

Yi-Geng Li

Chun-Chuan Chen

Siao-Wei Syu

A current sensing module for measuring a current includes a conductive substrate, a frame, a circuit board and a magnetic sensor. The conductive substrate has two terminals and at least one slot. The frame has two side portions and a bottom portion, wherein the bottom portion connects the two side portions to form an opening ring-shape. At least one of the two side portions is disposed in the at least one slot, such that the two side portions surround a partial path of the current. A gap exists between two top ends of the two side portions. The circuit board is disposed with respect to the conductive substrate. The magnetic sensor is connected to the circuit board and located in a space between the two side portions rather than in the gap. The magnetic sensor senses the current and generates a first current sensing signal correspondingly.

Current sensing module

The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.

Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure

A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.

Encapsulated electronic device mounted on a redistribution layer

A three-dimensional package structure, comprising: a substrate; a first plurality of discrete electronic components disposed over the bottom surface of the substrate, wherein a first insulating layer is disposed over the bottom surface of the substrate to encapsulate the first plurality of discrete electronic components, wherein at least one second insulating layer is disposed over the first insulating layer, wherein a plurality of surface-mount pads are disposed on the bottom surface of the at least one second insulating layer and electrically connected to at least one via disposed in the at least one second insulating layer.

Three-dimensional package structure and the method to fabricate thereof

The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.

Substrate and the method to fabricate thereof

Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor

The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that the size of electronic package structure can be reduced. The three-dimensional package structure comprises a substrate, a first plurality of discrete conductive components and a connecting structure. The substrate has a top surface and a bottom surface. The first plurality of discrete conductive components are disposed over the bottom surface of the substrate. The connecting structure is disposed over the bottom surface of the substrate for encapsulating the first plurality of discrete electronic components. The connecting structure comprises at least one insulating layer and a plurality of conductive patterns separated by the at least one insulating layer. The plurality of conductive patterns are disposed over the first plurality of discrete electronic components for electrically connecting the first plurality of discrete electronic components.

Growing community of inventors

Hsinchu, Taiwan

Ming-Chia Wu