The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Jul. 25, 2013
Applicants:
Bau-ru LU, Changhua County, TW;
Ming-chia Wu, Hsinchu, TW;
Inventors:
Bau-Ru Lu, Changhua County, TW;
Ming-Chia Wu, Hsinchu, TW;
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H05K 1/18 (2006.01); H01L 23/12 (2006.01); H05K 3/28 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/56 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24137 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0218 (2013.01);
Abstract
A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.