Kawasaki, Japan

Michio Sono


Average Co-Inventor Count = 4.3

ph-index = 15

Forward Citations = 809(Granted Patents)


Location History:

  • Yamato, JP (1987 - 1988)
  • Kawasaki, JP (1994 - 2003)

Company Filing History:


Years Active: 1987-2003

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28 patents (USPTO):Explore Patents

Title: Innovation in Solder Technology: The Contributions of Michio Sono

Introduction

Michio Sono, a prolific inventor based in Kawasaki, Japan, holds an impressive portfolio of 28 patents. His work primarily focuses on the methods for fabricating solder bumps, crucial for semiconductor chip production. Sono's innovative approaches have significantly advanced the field of electronic devices, presenting new techniques to enhance production quality and efficiency.

Latest Patents

Among Sono's latest patents, two stand out for their ingenuity: the "Bump-forming method using two plates" and a "Method for fabricating solder bumps by forming solder balls." The first patent details a process where first and second ball forming plates, filled with solder paste, are heated to create metal balls corresponding to the solder paste in the plates. This method allows for precise bump formation on semiconductor surfaces. The second patent outlines a procedure where a solder ball forming member with multiple cavities is used. By heating the solder paste, molten solder forms into balls, which are then transferred onto a semiconductor chip, ensuring optimal connectivity and performance.

Career Highlights

Michio Sono has contributed to the advancement of soldering technology while working with prominent companies, notably Fujitsu Corporation and Kyushu Fujitsu Electronics Limited. His tenure at these organizations has allowed him to turn his innovative ideas into patentable inventions, further establishing his reputation in the electronics industry.

Collaborations

Working alongside notable colleagues such as Junichi Kasai and Masanori Yoshimoto, Sono has forged valuable collaborations that have enriched his projects. Together, they have pushed the boundaries of technology, creating solutions that address the challenges faced by semiconductor manufacturing processes.

Conclusion

Michio Sono's contributions to the field of solder technology represent significant advancements in electronic device fabrication. With 28 patents to his name, his innovative methods continue to inspire and influence future generations of inventors and engineers in the semiconductor industry. Through his successful career, he has demonstrated the importance of innovation and collaboration in driving technological progress.

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