The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 1998
Filed:
Nov. 15, 1996
Norio Taniguchi, Tanabe, JP;
Junichi Kasai, Kawasaki, JP;
Kazuto Tsuji, Kawasaki, JP;
Michio Sono, Kawasaki, JP;
Masanori Yoshimoto, Kawasaki, JP;
Katsuhiro Hayashida, Kawasaki, JP;
Mitsutaka Sato, Kawasaki, JP;
Hiroshi Yoshimura, Kawasaki, JP;
Tadashi Uno, Kawasaki, JP;
Kosuke Otokita, Kawasaki, JP;
Tetsuya Fujisawa, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted on the first surface, a resin package encapsulating the semiconductor chip, where the resin package has upper and lower surfaces and side surfaces, a plurality of leads respectively having one end electrically connected to the semiconductor chip and another end extending downwardly from the lower surface of the resin package, and an upper extension, provided on the stage, extending upwardly from the upper surface of the resin package.