The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Dec. 28, 2000
Masayuki Ochiai, Kawasaki, JP;
Hidefumi Ueda, Kawasaki, JP;
Michio Sono, Kawasaki, JP;
Ichiro Yamaguchi, Kawasaki, JP;
Kazuhiko Mitobe, Kawasaki, JP;
Koki Otake, Kawasaki, JP;
Junichi Kasai, Kawasaki, JP;
Nobuo Kamehara, Kawasaki, JP;
Yasuo Yamagishi, Kawasaki, JP;
Masataka Mizukoshi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate . The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.