Fujitsu Corporation

Kyushu Fujitsu Electronics Limited

Fujitsu Automation Limited

Fujitsu Vlsi Limited

Michio Sono

Junichi Kasai

Kazuto Tsuji

Masanori Yoshimoto

Ichiro Yamaguchi

Koki Otake

Kazuhiko Mitobe

Kouji Saito

Masataka Mizukoshi

Yasuo Yamagishi

Yoshiyuki Yoneda

Mitsutaka Sato

Nobuo Kamehara

Hideharu Sakoda

Tetsuya Fujisawa

Masashi Takenaka

Masao Sakuma

Masayuki Ochiai

Hiroshi Yoshimura

Katsuhiro Hayashida

Norio Taniguchi

Yoshimi Suzuki

Hidefumi Ueda

Susumu Abe

Akira Takashima

Toshio Hamano

Yasuhiro Shinma

Yoshihiro Kubota

Yoshihiko Ikemoto

Masaaki Seki

Yukio Saigo

Tosiyuki Honda

Naomi Miyaji

Masahiko Ishiguri

Michio Hayakawa

Kosuke Otokita

Lim Cheang Hai

Yutaka Yamada

Tsuyoshi Aoki

Toshimi Kawahara

Akihiro Kubota

Tadashi Uno

Keiichi Masaki

Kousuke Otokita

Hiroaki Hayashi

First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate . The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.

Bump-forming method using two plates and electronic device

A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.

Method for fabricating solder bumps by forming solder balls with a

A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

Method for producing a semiconductor device, base member for

A semiconductor device includes a board having a lower surface, a container part created in the board, external-connection nodes provided on the lower surface of the board, a supporting member provided inside the container part and secured by the board, a semiconductor chip secured on the supporting member and electrically connected with the external-connection nodes, and a sealing resin fully filling the container part so as to completely cover the semiconductor chip.

Semiconductor device and method of forming the device

A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Semiconductor package for surface mounting

A process for manufacturing semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.

Process for manufacturing a packaged semiconductor having a divided

A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor element, and an outer-lead part which extends outward from the package toward a top of the package, and is to be connected to the external device. The outer-lead part includes a first-port part at a lower side of the package, and a second-port part at an upper side of the package.

Semiconductor device and semiconductor device unit for a stack

A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted on the first surface, a resin package encapsulating the semiconductor chip, where the resin package has upper and lower surfaces and side surfaces, a plurality of leads respectively having one end electrically connected to the semiconductor chip and another end extending downwardly from the lower surface of the resin package, and an upper extension, provided on the stage, extending upwardly from the upper surface of the resin package.

Semiconductor device and semiconductor device unit

A semiconductor device including a semiconductor element, and leads connected with the semiconductor element. Each of the leads includes an outer lead part for being connected externally. The semiconductor device further includes a plastic package sealing the semiconductor element and the leads. In the semiconductor device, the outer lead part is exposed to the outside of a side face of the plastic package, and the plastic package is mounted on any base in a standing form by the side face contacting the base.

Semiconductor device having an inner lead extending over a central

Semiconductor device, base member for semiconductor device and

A semiconductor integrated circuit device includes a semiconductor chip supported by a stage, leads electrically connected to the semiconductor chip, first and second heat radiating members provided on first and second sides of the semiconductor chip, and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members.

Semiconductor integrated circuit device and method of producing the

A semiconductor device unit includes a holder having a plurality of holding parts, and a plurality of semiconductor devices held by the holding parts of the holder. Each of the semiconductor devices has a generally parallelepiped shape with top and bottom surfaces and at least one side surface provided with leads which are exposed whereby the semiconductor device unit stands by itself on the leads.

Semiconductor device unit having holder

A method of producing a semiconductor device includes the steps of fitting a bottom part of a radiator block within a tapered hole which is provided at a bottom of a recess of a jig and positioning on the jig a lead frame having inner and outer leads and wherein the lead frame has an opening at a central part thereof, the opening being located above a top surface of the radiator block. The semiconductor chip is then mounted on the top surface part of the radiator block and bonded to the lead frame by plurality of wires. The radiator block is then positioned on a lower die and an upper die is positioned on top of the lower die and a resin is injected into a cavity formed by the two dies so as to mold the resin and form a package which encapsulates at least a part of the radiator block, the semiconductor chip, the wires and inner leads of the lead frame so that the outer leads of the lead frame extend outwardly of the package and the bottom part of the radiator block projects from the package by a predetermined length to conduct heat generated from the semiconductor chip outside the package. The jig then is removed from the package.

Semiconductor device having radiator structure

A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a &lt;110&gt; crystallographic plane, and an orientation flat in a &lt;1-11&gt; crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the &lt;1-11&gt; crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.

Process for forming solder balls on a plate having apertures using

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Kawasaki, Japan

Michio Sono