The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1998
Filed:
Sep. 18, 1995
Masaaki Seki, Kawasaki, JP;
Michio Sono, Kawasaki, JP;
Ichiro Yamaguchi, Kawasaki, JP;
Kazuhiko Mitobe, Kawasaki, JP;
Lim Cheang Hai, Kawasaki, JP;
Koki Otake, Kawasaki, JP;
Susumu Abe, Kawasaki, JP;
Junichi Kasai, Kawasaki, JP;
Masao Sakuma, Tochigi, JP;
Yoshimi Suzuki, Tochigi, JP;
Yasuhiro Shinma, Tochigi, JP;
Fujitsu Limited, Kawasaki, JP;
Fujitsu Automation Limited, Kawasaki, JP;
Abstract
A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.