The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2000
Filed:
Aug. 17, 1995
Masayuki Ochiai, Kawasaki, JP;
Hidefumi Ueda, Kawasaki, JP;
Michio Sono, Kawasaki, JP;
Ichiro Yamaguchi, Kawasaki, JP;
Kazuhiko Mitobe, Kawasaki, JP;
Koki Otake, Kawasaki, JP;
Junichi Kasai, Kawasaki, JP;
Nobuo Kamehara, Kawasaki, JP;
Yasuo Yamagishi, Kawasaki, JP;
Masataka Mizukoshi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.