Michele J Berry

Title: Innovations by Michele J Berry

Introduction

Michele J Berry is an accomplished inventor based in Chandler, AZ (US). She has made significant contributions to the field of microelectronics, holding a total of 5 patents. Her work focuses on enhancing the reliability and efficiency of electronic components.

Latest Patents

Michele's latest patents include innovative solutions such as the "Encapsulation of pin solder for maintaining accuracy in pin position." This invention addresses the issue of pin movement by enshrouding solder joints that couple pins to a microelectronic package substrate with an encapsulation material. This design ensures that pin movement is limited, even if the pin solder subsequently melts. Another notable patent is the "Metal ball attachment of heat dissipation devices," which describes an assembly that includes a heat dissipation device and a substrate, with a plurality of metal balls extending between their attachment surfaces. This assembly may also incorporate at least one microelectronic die, enhancing the overall thermal management of electronic devices.

Career Highlights

Michele J Berry is currently employed at Intel Corporation, where she continues to innovate and develop new technologies. Her work at Intel has positioned her as a key player in advancing microelectronic solutions.

Collaborations

Michele collaborates with talented individuals such as Qing Ma and Valluri Ramana Rao, contributing to a dynamic and innovative work environment.

Conclusion

Michele J Berry's contributions to microelectronics through her patents and work at Intel Corporation highlight her role as a leading inventor in the field. Her innovative solutions continue to impact the industry positively.