Intel Corporation

Michele J Berry

Qing Ma

Valluri Ramana Rao

Debendra Mallik

John Heck

Christopher L Rumer

Daniel M Wong

Steve W Greathouse

Jeffrey S Winton

Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.

Encapsulation of pin solder for maintaining accuracy in pin position

An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device attachment surface and the substrate attachment surface. The assembly may include at least one microelectronic die disposed between the heat dissipation device attachment surface and the substrate attachment surface.

Metal ball attachment of heat dissipation devices

In one embodiment, the invention provides a method comprising supporting a plurality of active electronic components on a first wafer; shaping a second wafer to define a plurality of spaces, each to accommodate one of the active electronic components when the second wafer is aligned and brought into face-to-face contact with that first wafer in a contact position; moving the second wafer into the contact position; and bonding the second wafer to the first wafer in the contact position.

Wafer-level packaging of electronic devices before singulation

A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.

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Chandler, AZ, United States of America

Michele J Berry