The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2006

Filed:

Apr. 02, 2003
Applicants:

Debendra Mallik, Chandler, AZ (US);

Christopher L. Rumer, Chandler, AZ (US);

Jeffrey S. Winton, Chandler, AZ (US);

Michele J. Berry, Chandler, AZ (US);

Inventors:

Debendra Mallik, Chandler, AZ (US);

Christopher L. Rumer, Chandler, AZ (US);

Jeffrey S. Winton, Chandler, AZ (US);

Michele J. Berry, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device attachment surface and the substrate attachment surface. The assembly may include at least one microelectronic die disposed between the heat dissipation device attachment surface and the substrate attachment surface.


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