Manfredonia, Italy

Michele Castriotta

This inventor holds 3 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2008-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michele Castriotta. Retrieved from https://idiyas.com/inventor/michele-castriotta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 33.3

Average Co-Inventor Count = 4.1

ph-index = 1

Forward Citations = 26(Granted Patents)


Location History:

  • Manfredonia, IT (2008 - 2009)
  • Ronco Briantino, IT (2016)

Company Filing History:


Years Active: 2008-2016

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3 patents (USPTO):Explore Patents

Title: Michele Castriotta: Innovator in Chip Packaging and Soldering Techniques

Introduction

Michele Castriotta is a notable inventor based in Manfredonia, Italy, recognized for his contributions to technology with three patents to his name. His innovative work primarily focuses on advancements in chip packaging and the handling of metallic elements in electronic applications.

Latest Patents

Among Michele's most recent patents is the development of an "Integrated helical multi-layer inductor structures." This invention details a chip package that includes a chip stack comprised of at least one chip and a thermal power plane featuring two substantially parallel dielectric layers. These layers contain conductive connectors strategically patterned within, with electrical interconnections achieved through vias that are perpendicular to these layers. This innovative configuration enhances power delivery to the chip through the inductors formed by the vias and connectors.

Another significant patent by Michele is titled "Handling and positioning of metallic plated balls for socket application in ball grid array packages." This technology presents a method for managing half-plated balls used in ball grid array sockets. His approach involves embedding these balls in a soft foil with a common orientation, utilizing a vacuumed cover clam for positioning the balls accurately on laminate pads. This invention aims to refine the soldering process, ensuring reliable connections in electronic circuits.

Career Highlights

Michele's contributions have significantly impacted the electronics industry, particularly through his role at the International Business Machines Corporation (IBM). His work aligns with IBM's commitment to innovation and advancing technology in chip design and electronic assembly.

Collaborations

Throughout his career, Michele has collaborated closely with esteemed colleagues such as Stefano Sergio Oggioni and Giorgio Viero. Their joint efforts reflect a dedication to innovation and the continuous improvement of electronic manufacturing processes.

Conclusion

Michele Castriotta stands out as a pioneering inventor whose patents contribute to the evolution of electronic technologies. His innovative solutions in chip packaging and soldering techniques demonstrate a deep understanding of engineering challenges, paving the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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