The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2008
Filed:
Apr. 18, 2003
Stefano Oggioni, Milan, IT;
Michele Castriotta, Manfredonia, IT;
Gianluca Rogiani, Milan, IT;
Mauro Spreafico, Sesto San Giovanni, IT;
Giorgio Viero, Stezzano, IT;
Stefano Oggioni, Milan, IT;
Michele Castriotta, Manfredonia, IT;
Gianluca Rogiani, Milan, IT;
Mauro Spreafico, Sesto San Giovanni, IT;
Giorgio Viero, Stezzano, IT;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A stacked via structure () adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks () belonging to three adjacent conductive layers () separated by dielectric layers (), aligned according to z axis. Connections between these conductive tracks are done with at least two vias () between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis.