The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7524698 B1

Expired

Date of Patent:

Apr. 28, 2009

Filed:

Dec. 02, 2005

Handling and positioning of metallic plated balls for socket application in ball grid array packages

Applicants:

Giorgio Viero, Stezzano, IT;

Stefano Sergio Oggioni, Milan, IT;

Michele Castriotta, Manfredonia, IT;

Inventors:

Giorgio Viero, Stezzano, IT;

Stefano Sergio Oggioni, Milan, IT;

Michele Castriotta, Manfredonia, IT;

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Todd M. C. Li

Primary Examiner:

Kenneth A Parker

Assistant Examiner:

Joseph Nguyen

Int. Cl.

CPC ...

H01L 21/44 (2006.01); H01L 21/48 (2006.01);

U.S. Cl.

CPC ...

Abstract

A method and apparatus for handling and positioning half plated balls for socket application in ball grid array packages. The half plated balls, comprising a first side adapted to be soldered and a second side adapted to establish reliable solderless electrical contact, are embedded in a soft foil, with a common orientation. The soft foil is positioned on a clam-receiving tool and a vacuumed caved cover clam is fitted on the balls and then pushed to cut and separate the polymer sheet from the copper ball surface. The vacuumed caved cover clam is then lifted with the oriented copper balls entrapped inside and the vacuumed caved cover clam places the entrapped balls on the laminate pads, with a deposit of low melt alloy. The air vacuum is deactivated and the cover is lifted, leaving the balls positioned on the pads while the soldering process is initiated and solder joints are formed to fix the balls.

Find Patent Forward Citations

Viero, Giorgio. (2009). Handling and positioning of metallic plated balls for socket application in ball grid array packages (U.S. Patent No. 7524698). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7524698

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile