Skaneateles, NY, United States of America

Michael Len

This inventor holds 10 USPTO granted patents and 3 published patent applications. Top assignees: Ttm Technologies Inc., Anaren, Inc., Anaren Microwave, Inc.. Active years: 2002-2025.

USPTO Granted Patents = 10 

% Patents Active = 100.0

Average Co-Inventor Count = 2.2

ph-index = 2

Forward Citations = 21(Granted Patents)


Location History:

  • Skaneateles, NY (US) (2002 - 2021)
  • Santa Ana, CA (US) (2023)

Company Filing History:


Years Active: 2002-2025

Loading Chart...
10 patents (USPTO):Explore Patents

Sure, let me write an article about inventor Michael Len based on the data provided.

Title: Innovator Spotlight: Michael Len - Pioneering Near-Hermetic Packaging and High-Powered RF Components

Introduction:

Michael Len, a prolific inventor hailing from Skaneateles, NY, has made significant strides in the field of electronic packaging and RF components. With a total of 7 patents to his name, Len is known for his innovative solutions that bridge the gap between functionality and manufacturability.

Latest Patents:

1. "Near-Hermetic Package with Flexible Signal Input and Output": Len's groundbreaking invention offers a cost-effective near-hermetic packaging solution for internal components. The package features a unique enclosure design with flexible circuits, enhancing the overall performance and reliability of electronic devices.

2. "High-Powered RF Part for Improved Manufacturability": Len's RF component design revolutionizes the way printed circuit boards are utilized in high-power applications. This invention showcases his prowess in developing efficient and scalable solutions for complex electronic systems.

Career Highlights:

Throughout his career, Michael Len has worked with renowned companies such as Anaren, Inc. and TTM Technologies Inc., where he has played a pivotal role in developing cutting-edge technologies. His expertise in electronic packaging and RF components has earned him recognition as a valuable asset in the industry.

Collaborations:

Len has collaborated closely with industry experts such as Chong Mei and Hans Peter Ostergaard. Together, they have shared their knowledge and skills to drive innovation in electronic packaging, setting new standards for quality and performance in the field.

Conclusion:

In conclusion, Michael Len's contributions to the world of electronic packaging and RF components have been nothing short of remarkable. His inventive spirit and dedication to pushing the boundaries of technology have solidified his position as a trailblazer in the industry. We look forward to seeing more groundbreaking inventions from this visionary inventor in the years to come.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to [email protected]
Loading…