The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Aug. 12, 2014
Applicant:

Anaren, Inc., East Syracuse, NY (US);

Inventors:

Hans P. Ostergaard, Viborg, DK;

Michael J. Len, Skaneateles, NY (US);

Chong Mei, Jamesville, NY (US);

Brian K. Buyea, Chittenango, NY (US);

Assignee:

ANAREN, INC., East Syracuse, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01P 11/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01P 1/203 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01P 3/081 (2013.01); H01L 23/49833 (2013.01); H01L 23/66 (2013.01); H01P 1/20345 (2013.01); H01P 11/003 (2013.01); H05K 1/036 (2013.01); H01L 2223/6627 (2013.01);
Abstract

The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.


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