For the Inventor, By the Inventor

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St. Louis, MO, United States of America

Ttm Technologies Inc.

USPTO Granted Patents = 20

% Expired Patents = 15.0

EPO Patents = 1

Trademarks = 6

Forward Citations = 8

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43 inventors (with patents filed for the assignee):

Michael Len (5 out of 10 patents)

Omar Eldaiki (4 out of 5 patents)

Chong Mei (4 out of 18 patents)

4. Hans Peter Ostergaard (2 out of 5 patents)

5. Tadd Hohlfelder (2 out of 2 patents)

6. Brad Moran (2 out of 2 patents)

7. Rubin Matthews (2 out of 2 patents)

8. Thomas Gannon (2 out of 2 patents)

9. Mace Lehrer (2 out of 2 patents)

10. James McKay (2 out of 2 patents)

11. Charles Blessing (2 out of 2 patents)

12. Niels Husted Kirkeby (2 out of 2 patents)

13. Samir Tozin (1 out of 1 patent)

14. John Vesce, Iii (1 out of 2 patents)

15. Joseph William Heery, Jr (1 out of 2 patents)

20 patents: Sort by Forward Citations

1. 12700653 - Stacked double junction circulator device and methods for fabrication (2026-08-04),

2. 12683261 - Folded circulator device with coupling elements and flex connections for interconnects and methods of fabricating the circulator device (2026-07-14),

3. 12666539 - Systems and methods for removing undesired metal within vias from printed circuit boards (2026-06-23),

4. 12614557 - System for detecting microphone communications made under stress, and for mitigating propagation of stressed voice communications (2026-04-28),

5. 12418085 - Circulator design and methods of fabricating the circulator (2025-09-16),

6. 12176592 - High powered RF part for improved manufacturability (2024-12-24),

7. 11997800 - Systems and methods for removing undesired metal within vias from printed circuit boards (2024-05-28),

8. 11729933 - Near-hermetic package with flexible signal input and output (2023-08-15),

9. 11711885 - Method of manufacturing printed circuit board assemblies with engineered thermal paths (2023-07-25),

10. 11693181 - High-density optical waveguide structure and printed circuit board and preparation method thereof (2023-07-04),

11. 11406008 - Wideband termination for high power applications (2022-08-02),

12. 11362407 - Directional couplers with DC insulated input and output ports (2022-06-14),

13. 11277909 - Three-dimensional circuit assembly with composite bonded encapsulation (2022-03-15),

14. 11158920 - High powered RF part for improved manufacturability (2021-10-26),

15. 10980127 - Methods for fabricating printed circuit board assemblies with high density via array (2021-04-13),

TTM Technologies, Inc. is a global leader in printed circuit board (PCB) manufacturing and electronic assembly services. They specialize in advanced technology solutions, delivering highly complex PCBs and electro-mechanical assemblies to various industries, including aerospace, automotive, telecommunications, and industrial equipment. TTM Technologies operates on a global scale with multiple state-of-the-art facilities to meet the demands of their diverse customer base.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

Ttm Technologies Inc.

20 Patents

#106 in St. Louis, MO

#233 in Missouri

#16,359 in US

#31,162 in the World

St. Louis, MO, United States of America

Ttm Technologies Inc.

Forward Citations = 8

43 inventors:

Michael Len (5 out of 10 patents)

Omar Eldaiki (4 out of 5 patents)

Chong Mei (4 out of 18 patents)

4. Hans Peter Ostergaard (2 out of 5 patents)

5. Tadd Hohlfelder (2 out of 2 patents)

Please report any incorrect information to [email protected]

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