For the Inventor, By the Inventor

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St. Louis, MO, United States of America

Ttm Technologies Inc.

USPTO Granted Patents = 20

% Expired Patents = 15.0

EPO Patents = 2

Trademarks = 6

Forward Citations = 8

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46 inventors (with patents filed for the assignee):

Michael Len (5 out of 10 patents)

Omar Eldaiki (4 out of 5 patents)

Chong Mei (4 out of 18 patents)

4. Hans Peter Ostergaard (2 out of 5 patents)

5. Tadd Hohlfelder (2 out of 2 patents)

6. Brad Moran (2 out of 2 patents)

7. Rubin Matthews (2 out of 2 patents)

8. Thomas Gannon (2 out of 2 patents)

9. Mace Lehrer (2 out of 2 patents)

10. James McKay (2 out of 2 patents)

11. Charles Blessing (2 out of 2 patents)

12. Niels Husted Kirkeby (2 out of 2 patents)

13. Samir Tozin (1 out of 1 patent)

14. John Vesce, Iii (1 out of 2 patents)

15. Joseph William Heery, Jr (1 out of 2 patents)

20 patents: Sort by Forward Citations

1. 12700653 - Stacked double junction circulator device and methods for fabrication (2026-08-04),

2. 12683261 - Folded circulator device with coupling elements and flex connections for interconnects and methods of fabricating the circulator device (2026-07-14),

3. 12666539 - Systems and methods for removing undesired metal within vias from printed circuit boards (2026-06-23),

4. 12614557 - System for detecting microphone communications made under stress, and for mitigating propagation of stressed voice communications (2026-04-28),

5. 12418085 - Circulator design and methods of fabricating the circulator (2025-09-16),

6. 12176592 - High powered RF part for improved manufacturability (2024-12-24),

7. 11997800 - Systems and methods for removing undesired metal within vias from printed circuit boards (2024-05-28),

8. 11729933 - Near-hermetic package with flexible signal input and output (2023-08-15),

9. 11711885 - Method of manufacturing printed circuit board assemblies with engineered thermal paths (2023-07-25),

10. 11693181 - High-density optical waveguide structure and printed circuit board and preparation method thereof (2023-07-04),

11. 11406008 - Wideband termination for high power applications (2022-08-02),

12. 11362407 - Directional couplers with DC insulated input and output ports (2022-06-14),

13. 11277909 - Three-dimensional circuit assembly with composite bonded encapsulation (2022-03-15),

14. 11158920 - High powered RF part for improved manufacturability (2021-10-26),

15. 10980127 - Methods for fabricating printed circuit board assemblies with high density via array (2021-04-13),

Ttm Technologies Inc. is a leading provider of advanced technology solutions, specializing in the design and manufacturing of printed circuit boards (PCBs) and electro-mechanical assemblies. The company serves a diverse range of industries, including telecommunications, aerospace, defense, and automotive, delivering high-quality products that meet rigorous standards. With a focus on innovation and engineering excellence, Ttm Technologies is committed to advancing electronic manufacturing processes and supporting the evolving needs of its global clientele.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

Ttm Technologies Inc.

20 Patents

#107 in St. Louis, MO

#233 in Missouri

#16,382 in US

#31,233 in the World

St. Louis, MO, United States of America

Ttm Technologies Inc.

Forward Citations = 8

46 inventors:

Michael Len (5 out of 10 patents)

Omar Eldaiki (4 out of 5 patents)

Chong Mei (4 out of 18 patents)

4. Hans Peter Ostergaard (2 out of 5 patents)

5. Tadd Hohlfelder (2 out of 2 patents)

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