The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Aug. 28, 2020
Applicant:
Ttm Technologies, Inc., Santa Ana, CA (US);
Inventors:
John Vesce, III, Somers, CT (US);
Joseph William Heery, Jr., Tolland, CT (US);
Assignee:
TTM TECHNOLOGIES INC., Santa Ana, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/12 (2006.01); H01L 23/14 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); H05K 1/0284 (2013.01); H05K 3/0014 (2013.01); H05K 3/467 (2013.01); H05K 2201/0275 (2013.01); H05K 2201/05 (2013.01);
Abstract
The disclosure provides a three-dimensional circuit assembly including a printed circuit board comprising a top film surface and a bottom film surface opposite to the top film surface. The three-dimensional circuit assembly may also include a first layer of a composite material bonded or laminated on the top film surface. The three-dimensional circuit assembly may further include a second layer of the composite material bonded or laminated on the bottom film surface of the printed circuit board.