This inventor holds 2 USPTO granted patents. Top assignees: Ttm Technologies Inc., Other. Active years: 2016-2022.
Company Filing History:
1 out of 20 
1 out of 834,307 Years Active: 2016-2022
Title: John Vesce, III: Innovator in Circuit Assembly Technology
Introduction
John Vesce, III is a notable inventor based in Somers, CT (US). He has made significant contributions to the field of circuit assembly technology, holding a total of 2 patents. His work focuses on innovative methods and materials that enhance the functionality and efficiency of printed circuit boards.
Latest Patents
One of his latest patents is titled "Three-dimensional circuit assembly with composite bonded encapsulation." This invention provides a three-dimensional circuit assembly that includes a printed circuit board with a top film surface and a bottom film surface. The assembly features a first layer of composite material bonded to the top film surface and a second layer bonded to the bottom film surface. This design aims to improve the durability and performance of circuit assemblies.
Another significant patent by John Vesce, III is the "Method of fabricating a printed circuit board interconnect assembly." This invention outlines a comprehensive method for fabricating an interconnect by aligning and stacking multiple printed circuit boards with an adhesive component. The process includes laminating the boards, preparing bonded pair holes, depositing a copper seed layer, and electroplating a copper layer, among other steps. This method enhances the efficiency of circuit board manufacturing.
Career Highlights
Throughout his career, John Vesce, III has worked with TTM Technologies Inc., where he has contributed to advancements in circuit technology. His expertise in the field has allowed him to develop innovative solutions that address industry challenges.
Collaborations
John has collaborated with various professionals, including his coworker Joseph William Heery, Jr. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.
Conclusion
John Vesce, III is a distinguished inventor whose work in circuit assembly technology has made a lasting impact on the industry. His patents reflect his commitment to innovation and excellence in engineering.