Ttm Technologies Inc.

Anaren, Inc.

Anaren Microwave, Inc.

Michael Len

Chong Mei

Hans Peter Ostergaard

Michael Lugert

Nicholas S Koop

King Yip Leung

Raj Kumar

Niels Husted Kirkeby

Brian K Buyea

Thomas Lingel

Brady Fitzgerald

Hans P Ostergaard

Mark Bowyer

Andrew Kempf

Benton O'Neil

Matt Gortner

Matthew D Neely

A circulator for radio frequency is provided. The circulator may include a ferrite stripline assembly, which includes a first ferrite layer, a second ferrite layer over the first ferrite layer, and a junction circuit between the first ferrite layer and the second ferrite layer. The circulator may also include a magnet over the second ferrite layer for providing magnetic bias.

Circulator design and methods of fabricating the circulator

A method for forming a thermal and electrical path in a PCB may include forming a first removable layer over a top surface of a PCB and a second removable layer over a bottom surface of the PCB. The method may also include milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB, plating the first side panel plating the first side with a second metal to partially fill the first cavity; and milling or laser drilling from the bottom surface to form a second cavity extending into the PCB, the first cavity in a thermal communication and/or an electrical communication with the second cavity. The method may also include panel plating the first side with a second metal to fill the first cavity and the second side with the second metal to fill the second cavity, and removing the first and second removable layers from the PCB to form the PCB with a thermal and/or an electrical path comprising the first cavity and the second cavity filled with the second metal.

Methods for forming engineered thermal paths of printed circuit boards by use of removable layers

An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

High powered RF part for improved manufacturability

The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.

Near-hermetic package with flexible signal input and output

A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.

Methods for fabricating printed circuit board assemblies with high density via array

The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.

Stress relieved high power RF circuit

An RF power resistor includes: a lossy layer; and a dielectric layer. The lossy layer is shaped and/or sized as a transmission line. The lossy layer is made of a lossy material. The dielectric layer is made of a dielectric material. The lossy layer and the dielectric material are located to be adjacent to each other and in contact with each other.

RF resistor with lossy traces

The present invention is directed to an RF device that includes a ceramic layer characterized by a ceramic layer dielectric constant and includes an RF circuit arrangement having a predetermined geometry and predetermined electrical characteristics. The ceramic layer dissipates thermal energy generated by the RF circuit via substantially the entire ceramic surface area. A first dielectric layer comprises a thermoplastic material and has a predetermined first thickness and a first dielectric constant. The predetermined electrical characteristics of the RF circuit arrangement are a function of the ceramic layer dielectric constant. A relative softness of the thermoplastic material is a function of the RF device operating temperature.

High power RF circuit

A method and apparatus for making a connection to or between one or more modules in a microwave communication system includes a first module having a plurality of contact pads mounted on a surface adjacent one edge of the module; optionally a second module having a plurality of contact pads mounted on a surface adjacent a confronting edge of the second module; a contact assembly including a housing and a plurality of resilient contacts disposed within the housing, each contact having at least a first and optionally a second contact surface aligned with and connected to the contact pads on the first and second modules respectively; and a plurality of screws or the like for anchoring the housing to the first and optionally the second module and bridging the gap between them, the housing arranged to deform the plurality of contacts to urge them into resilient engagement with the contact pads on the modules.

Growing community of inventors

Skaneateles, NY, United States of America

Michael Len