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For the Inventor, By the Inventor

Boise, ID, United States of America

Michael A Walker

USPTO Granted Patents = 73 

Average Co-Inventor Count = 1.9

ph-index = 31

Forward Citations = 2,414(Granted Patents)

Forward Citations (Not Self Cited) = 2,400(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Boise, ID (US) (1992 - 2010)
  • Kuna, ID (US) (2001 - 2012)

Company Filing History:

goldMedal72 out of 37,972 
 
Micron Technology Incorporated
 patents
silverMedal1 out of 1 
 
Tri-walker, LLC
 patent

Years Active: 1992-2012

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Areas of Expertise:
Laser Alignment
Self-Aligned Interconnect Structures
Permeable Capacitor Electrode
Chemical Mechanical Planarization
Fixed Abrasive Polishing Pad
Microelectronic Substrate Assemblies
Trench Isolation Regions
Stacked Capacitors
Surface Cleaning Apparatus
Polishing Polymer Surfaces
Semiconductor Processing
Polishing Pad Methods
73 patents (USPTO):Explore Patents
1. 8209874 - Building frame construction tools and methods using laser alignment (2012-07-03),
2. 7825450 - Sacrificial self-aligned interconnect structures (2010-11-02),
3. 7427793 - Sacrificial self-aligned interconnect structure (2008-09-23),
4. 7329917 - Permeable capacitor electrode (2008-02-12),
5. RE39665 - Optimized container stacked capacitor DRAM cell utilizing sacrificial oxide deposition and chemical mechanical polishing (2007-05-28),
6. 7179706 - Permeable capacitor electrode (2007-02-20),
7. 6995072 - Method of making sacrificial self-aligned interconnection structure (2006-02-07),
8. 6818501 - Method of making a self-aligned recessed container cell capacitor (2004-11-16),
9. 6803316 - Method of planarizing by removing all or part of an oxidizable material layer from a semiconductor substrate (2004-10-12),
10. 6784069 - Permeable capacitor electrode (2004-08-31),
11. 6672951 - Fixed abrasive polishing pad (2004-01-06),
12. 6635574 - Method of removing material from a semiconductor substrate (2003-10-21),
13. 6558234 - Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates (2003-05-06),
14. 6540593 - Fixed abrasive polishing pad (2003-04-01),
15. 6527626 - Fixed abrasive polishing pad (2003-03-04),

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