The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Dec. 13, 2001
Applicant:
Inventors:
Michael A. Walker, Boise, ID (US);
Karl M. Robinson, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/00 ;
U.S. Cl.
CPC ...
B24B 7/00 ;
Abstract
The present invention provides an apparatus for performing mechanical polishing of a semiconductor wafer surface that includes a polishing pad, a wafer support, and a motor. The polishing pad includes a polishing face, an abrasive first member, and means for impeding abrasion of the surface by the first member. The wafer support includes a support surface, and is disposed opposite to the pad. The motor operatively engages at least one of the polishing pad and the wafer support.