Meng Chen

Title: Inventor Meng Chen: Innovator in Semiconductor Technology

Introduction

Meng Chen, a prominent inventor based in Shanghai, China, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of five patents, he is recognized for his innovative approaches to improving the efficiency and reliability of semiconductor substrates.

Latest Patents

Meng's latest patents include groundbreaking advancements in semiconductor bonding methods. The first patent, titled "Bonding method for semiconductor substrate," focuses on a novel technique that enhances the flatness of bonded substrates. This method involves thermally treating the semiconductor substrate before bonding, where oxygen precipitates are converted into interstitial oxygen atoms, thereby improving the substrate's overall quality.

Another significant patent is the "Method for cleaning bonding interface before bonding," which outlines a procedure for cleaning the bonding surfaces. This method specifies the use of ammonia for cleaning both non-crystal and crystal surfaces, employing distinct parameters for each to improve bonding efficacy.

Career Highlights

Meng Chen is affiliated with Shanghai Simgui Technology Co., Ltd., a reputable company specializing in semiconductor solutions. His work there has been instrumental in advancing the company's technological capacities and ensuring progress in various semiconductor applications.

Collaborations

Throughout his career, Meng has collaborated with notable colleagues, including Xing Wei and Yongwei Chang. Their combined expertise has propelled innovative projects forward, reinforcing the importance of teamwork in the field of research and development.

Conclusion

Meng Chen stands out as a dedicated inventor in the semiconductor industry, with a focus on innovative bonding methods and cleaning techniques. His contributions not only enhance technological advancements but also pave the way for future innovations in semiconductor applications.