The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Feb. 26, 2018
Applicant:

Shanghai Simgui Technology Co., Ltd., Shanghai, CN;

Inventors:

Xing Wei, Shanghai, CN;

Yongwei Chang, Shanghai, CN;

Meng Chen, Shanghai, CN;

Guoxing Chen, Shanghai, CN;

Lu Fei, Shanghai, CN;

Xi Wang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/3115 (2006.01); H01L 21/322 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); H01L 21/31155 (2013.01); H01L 21/3226 (2013.01); H01L 23/552 (2013.01);
Abstract

The present disclosure provides a method for preparing a substrate with a carrier trapping center. The method includes: implanting bubbling ions into the semiconductor substrate to form a splitting layer, and implanting modified ions into the insulating layer to form a nano cluster; providing a supporting substrate; bonding the supporting substrate to the semiconductor substrate by using the insulating layer as an intermediate layer; performing a first heat treatment for the bonded substrate such that a splitting layer is formed at the position where the bubbling ions are implanted, and causing the semiconductor substrate to split at the position of the splitting layer; performing rapid thermal annealing for the substrate; and performing a second heat treatment for the rapidly thermally annealed semiconductor substrate to consolidate the bonding interface and form the nano cluster at the position where the modified ions are implanted.


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