Company Filing History:
Years Active: 2019-2020
Title: Yongwei Chang: Innovator in Bonding Technologies
Introduction
Yongwei Chang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of bonding technologies, holding a total of 4 patents. His innovative methods have the potential to enhance the efficiency and effectiveness of bonding processes in various applications.
Latest Patents
Chang's latest patents include a method for cleaning bonding interfaces before bonding and an annealing method for improving bonding strength. The cleaning method involves providing a first surface and a second surface for bonding, where the first surface is a non-crystal surface and the second surface is a crystal surface. The method emphasizes cleaning both surfaces with ammonia, with specific parameters for ammonia concentration and cleaning temperature tailored to each surface. The annealing method focuses on improving the interface bonding strength of a wafer. It includes a two-step annealing process, where the first step occurs in an oxygen-containing atmosphere to form an oxidation protection layer, followed by a second step in a nitrogen-free environment at a higher temperature.
Career Highlights
Yongwei Chang is currently employed at Shanghai Simgui Technology Co., Ltd. His work at this company has allowed him to develop and refine his innovative bonding techniques. His contributions have been instrumental in advancing the company's technological capabilities.
Collaborations
Chang collaborates with talented coworkers, including Xing Wei and Meng Chen. Their combined expertise fosters a creative environment that drives innovation in bonding technologies.
Conclusion
Yongwei Chang is a notable inventor whose work in bonding technologies has led to significant advancements in the field. His patents reflect a commitment to improving bonding processes, showcasing his innovative spirit and dedication to technological progress.