The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Sep. 26, 2019
Applicant:
Shanghai Simgui Technology Co., Ltd., Shanghai, CN;
Inventors:
Xing Wei, Shanghai, CN;
Xin Su, Shanghai, CN;
Hongtao Xu, Shanghai, CN;
Meng Chen, Shanghai, CN;
Nan Gao, Shanghai, CN;
Assignee:
Shanghai Simgui Technology Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/762 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/76251 (2013.01); H01L 27/1203 (2013.01);
Abstract
The present disclosure provides a bonding method for a semiconductor substrate, which may improve flatness of a bonded substrate. The present disclosure further provides a bonded semiconductor substrate. The semiconductor substrate is thermally treated prior to bonding, and oxygen precipitates in the semiconductor substrate are partially or totally converted to interstitial oxygen atoms in the thermal treatment.