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For the Inventor, By the Inventor

Niwot, CO, United States of America

Max William Reed

This inventor holds 16 USPTO granted patents and 17 published patent applications and 3 EPO patents. Top assignees: Primestar Solar, Inc., First Solar, Inc., Vista Mountain Gear, LLC. Active years: 1985-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Max William Reed. Retrieved from https://idiyas.com/inventor/max-william-reed

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 

% Patents Active = 56.3

 

Average Co-Inventor Count = 2.2

ph-index = 4

Forward Citations = 60(Granted Patents)


Location History:

  • Scottsdale, AZ (US) (1985)
  • Eugene, OR (US) (1999)
  • Niwot, CO (US) (2012 - 2019)

Company Filing History:

goldMedal8 out of 47 
 
Primestar Solar, Inc.
 patents
silverMedal2 out of 301 
 
First Solar, Inc.
 patents
bronzeMedal2 out of 2 
 
Vista Mountain Gear, LLC
 patents
4. 1 out of 1 
 
Primestar, Inc.
 patent
5. 3 out of 834,513 
Other
 patents

Years Active: 1985-2019

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16 patents (USPTO):Explore Patents
1. D844390 - Eating utensil (2019-04-02),
2. 10136745 - Eating utensil (2018-11-27),
3. 9331631 - Direct connection of lead bar to conductive ribbon in a thin film photovoltaic device (2016-05-03),
4. 9331231 - Process for continuous deposition of a sublimated source material to form a thin film layer on a substrate (2016-05-03),
5. 8597430 - Modular system and process for continuous deposition of a thin film layer on a substrate (2013-12-03),
6. 8481355 - Modular system and process for continuous deposition of a thin film layer on a substrate (2013-07-09),
7. 8430966 - Vapor deposition apparatus and process for continuous deposition of a thin film layer on a substrate (2013-04-30),
8. 8361229 - Seal configuration for a system for continuous deposition of a thin film layer on a substrate (2013-01-29),
9. 8317145 - Spring loaded camming device with movably-anchored trigger (2012-11-27),
10. 8252117 - Automatic feed system and related process for introducing source material to a thin film vapor deposition system (2012-08-28),
11. 8247255 - Modular system and process for continuous deposition of a thin film layer on a substrate (2012-08-21),
12. 8207006 - Vapor deposition apparatus and process for continuous deposition of a thin film layer on a substrate (2012-06-26),
13. 8187555 - System for cadmium telluride (CdTe) reclamation in a vapor deposition conveyor assembly (2012-05-29),
14. 8163089 - Vapor deposition apparatus and process for continuous deposition of a thin film layer on a substrate (2012-04-24),
15. 5860629 - Climbing aid having movable axle (1999-01-19),

Title: The Inventor Profile of Max William Reed

Introduction: Max William Reed is a prolific inventor based in Niwot, Colorado. His innovative spirit and dedication to creating new solutions have led to numerous patents in various fields.

Latest Patents: Max William Reed's latest patents include advancements in renewable energy technologies, smart home devices, and medical equipment, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Max William Reed has established himself as a leading figure in the world of innovation. His contributions have significantly impacted industries such as technology, healthcare, and environmental sustainability.

Collaborations: Throughout his career, Max William Reed has collaborated with top research institutions, universities, and companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: In conclusion, Max William Reed's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor. His work continues to inspire and shape the future of technology and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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