The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2013

Filed:

Dec. 16, 2009
Applicants:

Christopher Rathweg, Louisville, CO (US);

Max William Reed, Niwot, CO (US);

Mark Jeffrey Pavol, Arvada, CO (US);

Scott Daniel Feldman-peabody, Golden, CO (US);

Russell Weldon Black, Longmont, CO (US);

Inventors:

Christopher Rathweg, Louisville, CO (US);

Max William Reed, Niwot, CO (US);

Mark Jeffrey Pavol, Arvada, CO (US);

Scott Daniel Feldman-Peabody, Golden, CO (US);

Russell Weldon Black, Longmont, CO (US);

Assignee:

Primestar Solar, Inc., Arvada, CO (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 31/18 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus and related process are provided for vapor deposition of a sublimated source material as a thin film on a photovoltaic (PV) module substrate. A receptacle is disposed within a vacuum head chamber and is configured for receipt of a source material. A heated distribution manifold is disposed below the receptacle and includes a plurality of passages defined therethrough. The receptacle is indirectly heated by the distribution manifold to a degree sufficient to sublimate source material within the receptacle. A distribution plate is disposed below the distribution manifold and at a defined distance above a horizontal plane of a substrate conveyed through the apparatus. The distribution plate includes a pattern of holes therethrough that further distribute the sublimated source material passing through the distribution manifold onto the upper surface of the underlying substrate.


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