The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2012

Filed:

Dec. 15, 2009
Applicants:

Mark Jeffrey Pavol, Arvada, CO (US);

Russell Weldon Black, Longmont, CO (US);

Brian Robert Murphy, Golden, CO (US);

Christopher Rathweg, Louisville, CO (US);

Edwin Jackson Little, Denver, CO (US);

Max William Reed, Niwot, CO (US);

Inventors:

Mark Jeffrey Pavol, Arvada, CO (US);

Russell Weldon Black, Longmont, CO (US);

Brian Robert Murphy, Golden, CO (US);

Christopher Rathweg, Louisville, CO (US);

Edwin Jackson Little, Denver, CO (US);

Max William Reed, Niwot, CO (US);

Assignee:

PrimeStar, Inc., Arvada, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process and associated system for vapor deposition of a thin film layer on a photovoltaic (PV) module substrate is includes establishing a vacuum chamber and introducing the substrates individually into the vacuum chamber. The substrates are pre-heated as they are conveyed through the vacuum chamber, and are then conveyed in serial arrangement through a vapor deposition apparatus in the vacuum chamber wherein a thin film of a sublimed source material is deposited onto an upper surface of the substrates. The substrates are conveyed through the vapor deposition apparatus at a controlled constant linear speed such that leading and trailing sections of the substrate in a conveyance direction are exposed to the same vapor deposition conditions within the vapor deposition apparatus. The vapor deposition apparatus may be supplied with source material in a manner so as not to interrupt the vapor deposition process or non-stop conveyance of the substrates through the vapor deposition apparatus.


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