Yokohama, Japan

Masayuki Ishikawa

USPTO Granted Patents = 143 

 

Average Co-Inventor Count = 3.8

ph-index = 23

Forward Citations = 2,595(Granted Patents)


Inventors with similar research interests:


Location History:

  • Setagaya, Tokyo, JA (1976)
  • Tokyo, JA (1977)
  • Setagaya-ku, Tokyo JP (1981)
  • Setagaya-ku, Tokyo, JP (1980 - 1984)
  • Nishimine, JP (1990 - 1991)
  • Kawasaki, JP (1991)
  • Goleta, CA (US) (1992)
  • Kouza-gun, JP (2004 - 2008)
  • Sapporo, JP (2002 - 2009)
  • Kanagawa, JP (2003 - 2011)
  • Yokohama, JP (1996 - 2013)
  • Aichi, JP (2011 - 2014)
  • Kanagawa-ken, JP (1996 - 2017)
  • Ebina, JP (2007 - 2017)
  • Osaka, JP (2010 - 2019)
  • Suwa, JP (2012 - 2021)
  • Tokyo, JP (1983 - 2022)
  • Sanda, JP (2006 - 2022)

Company Filing History:

goldMedal77 out of 52,711 
 
Kabushiki Kaisha Toshiba
 patents
silverMedal18 out of 33,404 
 
Seiko Epson Corporation
 patents
bronzeMedal7 out of 4,618 
 
Mitsubishi Heavy Industries Limited
 patents
45 out of 1,530 
 
Mitsubishi Materials Corporation
 patents
53 out of 4,979 
 
Oki Electric Industry Co., Ltd.
 patents
63 out of 906 
 
Tsubakimoto Chain Company
 patents
73 out of 2,636 
 
Hitachi Global Storage Technologies Netherlands B.v.
 patents
83 out of 100 
 
Epson Toyocom Corporation
 patents
92 out of 516 
 
Toshiba Mitsubishi-electric Industrial Systems Corporation
 patents
102 out of 4,119 
 
Wisconsin Alumni Research Foundation
 patents
112 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents
122 out of 162 
 
Mitsubishi Heavy Industries Thermal Systems, Ltd.
 patents
132 out of 35 
 
Mitsubishi Heavy Industries Automotive Thermal Systems Co., Ltd.
 patents
141 out of 6 
 
Kabsuhiki Kaisha Toshiba
 patents
151 out of 89 
 
Toyo Communication Equipment Co., Ltd.
 patents
161 out of 1 
 
Masayuki Ishikawa
 patent
171 out of 987 
 
Hgst Netherlands, B.v.
 patents
181 out of 48 
 
Mitsubishi Logisnext Co. Ltd.
 patents
191 out of 2,467 
 
Nec Electronics Corporation
 patents
201 out of 814 
 
Kyoto University
 patents
211 out of 1,960 
 
Showa Denko K.k.
 patents
227 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1976-2025

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143 patents (USPTO):

Title: Masayuki Ishikawa: Pioneering Innovations in Electronic Components and Power Module Substrates

Introduction:

Masayuki Ishikawa, a brilliant inventor hailing from Yokohama, Japan, has firmly established himself as a notable figure in the world of electronic components and power module substrates. With an impressive portfolio of patents and a history of collaborating with renowned organizations, Ishikawa's contributions have undoubtedly shaped the field of technology and manufacturing. In this article, we will delve into his latest patents, career highlights, notable collaborations, and the significance of his innovative work.

Latest Patents:

Ishikawa's relentless pursuit of innovation is evident in his latest patents. One such patent is titled "Electronic Component and Method of Manufacturing Electronic Component." This invention features an electronic component composed of a ceramic element with glass-containing Au layers on both surfaces, complemented by an Au-Sn alloy layer on at least one of the glass-containing Au layers. Notably, a pure-Au layer is sandwiched between the glass-containing Au layer and the Au-Sn alloy layer, with the Au-Sn alloy layer exhibiting an Au-Sn eutectic structure. This invention sheds light on advancements in electronic component manufacturing, potentially leading to enhanced performance and reliability.

Another notable patent is the "Heat Sink-Equipped Power Module Substrate and Manufacturing Method." This invention introduces a power module substrate with an integrated heat sink. The substrate consists of an insulating substrate with a circuit layer on one side and a metal layer on the opposite surface. The heat sink is connected to the metal layer using a sintered bonding layer made of silver particles. This inventive solution provides efficient heat dissipation, which is crucial for power module functionality and reliability.

Career Highlights:

Throughout his illustrious career, Ishikawa has made significant contributions to the industry through his work with prominent companies. Notably, he has been associated with Kabushiki Kaisha Toshiba and Seiko Epson Corporation, two highly regarded organizations in the technology and electronics sectors. His tenure with these companies indicates his expertise in developing cutting-edge solutions and his commitment to driving innovation in the field.

Collaborations:

Ishikawa's collaborations with fellow inventors have also contributed to his success and the broader field of electronics. Notable colleagues include Genichi Hatakoshi and Hideto Sugawara. These partnerships emphasize the importance of collaboration in the invention process, as knowledge sharing and teamwork can often lead to groundbreaking discoveries.

Conclusion:

Masayuki Ishikawa's impressive portfolio of 138 patents, his pioneering work in electronic components and power module substrates, and his collaborations with industry experts have firmly established him as a leading innovator in the field. With his latest patents showcasing advancements in electronic components and power module substrate manufacturing, Ishikawa continues to drive progress and shape the future of technology. His contributions inspire others to push the boundaries of innovation and ultimately create a more advanced and connected world.

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