logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11396164 B1

PDFFull Text
Date of Patent:
Jul. 26, 2022

Filed:

Aug. 09, 2019

Electronic component and method of manufacturing electronic component

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Masayuki Ishikawa, Tokyo, JP;

Satoru Daido, Sanda, JP;

Kaoru Nishizawa, Chichibu-gun, JP;

Akihiro Yoshida, Chichibu-gun, JP;

Hiroki Sato, Chichibu-gun, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorney:

Locke Lord LLP

Primary Examiner:

Daniel J Schleis

Assistant Examiner:

Kevin Ct Li

Int. Cl.
CPC ...
H01C 7/04 (2006.01); H01C 1/01 (2006.01); H01C 17/00 (2006.01); H01C 7/02 (2006.01); H01F 27/06 (2006.01); H01G 2/06 (2006.01); H01G 13/00 (2013.01); H05K 3/34 (2006.01); B32B 18/00 (2006.01); B32B 17/06 (2006.01);
U.S. Cl.
CPC ...
B32B 18/00 (2013.01); B32B 17/061 (2013.01); B32B 2250/40 (2013.01); B32B 2255/205 (2013.01); B32B 2307/202 (2013.01); B32B 2309/02 (2013.01); B32B 2311/04 (2013.01); B32B 2311/16 (2013.01); B32B 2315/02 (2013.01); B32B 2315/08 (2013.01); B32B 2457/00 (2013.01);
Abstract

An electronic component includes a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au—Sn alloy layer formed on at least one of the glass-containing Au layers; the electronic component further includes a pure-Au layer between the glass-containing Au layer and the Au—Sn alloy layer; furthermore, the Au—Sn alloy layer has an Au—Sn eutectic structure.

Find Patent Forward Citations

Ishikawa, Masayuki. (2022). Electronic component and method of manufacturing electronic component (U.S. Patent No. 11396164). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11396164

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…