Company Filing History:

8 out of 27,375

Matsushita Electric Industrial Co., Ltd.

patents

5 out of 16,453

Panasonic Corporation

patents

1 out of 832,843

Other

patents

Years Active: 1998-2013

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. RE44384 - Method and device for mounting electronic component (2013-07-22),

2. 7667299 - Circuit board and method for mounting chip component (2010-02-23),

3. 7540078 - Method for recycling wastes of an electrical appliance (2009-06-02),

4. 7473476 - Soldering method, component to be joined by the soldering method, and joining structure (2009-01-06),

5. 7471260 - Semiconductor memory module having built-in antenna (2008-12-30),

6. 7150387 - Process and apparatus for flow soldering (2006-12-19),

7. 6871775 - Process for soldering and connecting structure (2005-03-29),

8. 6708402 - Method and device for mounting electronic component (2004-03-23),

9. 6702175 - Method of soldering using lead-free solder and bonded article prepared through soldering by the method (2004-03-09),

10. 6648216 - Process and apparatus for flow soldering (2003-11-18),

11. 6493931 - Method and device for mounting electronic component (2002-12-17),

12. 6230393 - Method and device for mounting electronic component (2001-05-15),

13. 5868302 - Method and apparatus for mounting electronic component (1999-02-09),

14. 5743007 - Method of mounting electronics component (1998-04-28),

Title: Masato Hirano: Innovator in Electronic Component Mounting Technology

Introduction

Masato Hirano is a prominent inventor based in Toyonaka, Japan. He has made significant contributions to the field of electronic component mounting technology, holding a total of 14 patents. His innovative approaches have enhanced the efficiency and reliability of component assembly processes.

Latest Patents

Hirano's latest patents include a method and device for mounting electronic components. In this invention, a component mounting device utilizes a suction nozzle to pick up and mount components on a circuit board. The device measures the displacement between the center position of the suction nozzle and that of the picked-up component. If the displacement exceeds a predetermined value, a warning is generated to indicate an abnormal condition in the parts cassette, and the mounting action is halted. Another notable patent is for a circuit board that features a substrate with electrode patterns. This design allows for the mounting of first chip components on the substrate and second chip components on the opposite side of the first components. By stacking chip components in multiple stages, this innovation enables high-density mounting, thereby reducing the overall size of the circuit board.

Career Highlights

Throughout his career, Masato Hirano has worked with notable companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in electronic component technology.

Collaborations

Hirano has collaborated with several talented individuals in his field, including Atsushi Yamaguchi and Yoshinori Sakai. These collaborations have contributed to the advancement of technology in electronic component mounting.

Conclusion

Masato Hirano's contributions to electronic component mounting technology have made a lasting impact on the industry. His innovative patents and collaborations reflect his dedication to advancing technology and improving manufacturing processes.

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