Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Other

Masato Hirano

Atsushi Yamaguchi

Yoshinori Sakai

Tateo Nakashima

Kenichiro Suetsugu

Hiroaki Onishi

Shunji Hibino

Norihito Tsukahara

Mikiya Nakata

Masato Mori

Hidenobu Nishikawa

Kazuto Nishida

Shozo Ochi

Kazuhiro Ikurumi

Kiyoshi Nakanishi

Kazumi Matsushige

Haruto Nagata

Takashi Ikari

Toshihisa Horiuchi

Akihiko Odani

In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzleand that of the picked-up componentis measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassettefrom which the componenthas been fed is in abnormal condition, as well as the mounting action of the componentis stopped.

Method and device for mounting electronic component

A circuit board includes a substrate including electrode patterns formed thereon, first chip components mounted on the substrate and a second chip component mounted on a side of electrodes of the first chip components opposite from the substrate. The second chip component is bonded at one electrode to an electrode of the first chip component and is also bonded at the other electrode to an electrode of the first chip component. By stacking chip components in plural stages, it is possible to mount chip components with a high density on the substrate, thereby enabling reduction of the size of the circuit board.

Circuit board and method for mounting chip component

A recycling method of wastes of an electrical appliance containing an article having a circuit soldered with parts soldered with a lead free solder. The method includes discriminating a first article having a circuit soldered with lead free parts from a second article having a circuit soldered with lead containing parts; recovering, grinding and melting each of the first and second articles to separate materials of the first article and materials of the second article; recycling reusable valuables contained in the materials of the first article and second article; and shredding a portion of the first and second article not containing the reusable valuables and burying/treating the portion at a stabilizing dumping ground or a controlled dumping ground for disposal.

Method for recycling wastes of an electrical appliance

It is possible to prevent deterioration of a soldering portion and improve strength of thermal fatigue resistance by providing barrier metal layers on at least one of lead and land to cover parent materials comprising Cu-containing materials, feeding a soldering material between the lead and the land and allowing to contact in a fused condition with barrier metal layers and solidify, and thus soldering together the lead and the land.

Soldering method, component to be joined by the soldering method, and joining structure

A semiconductor memory module formed of a mounted module () having a semiconductor memory device () and a control semiconductor device (), a circuit board () which contains connection terminal () coupled with the control semiconductor device () and disposed so that it is exposed from the surface of outer case (), and an antenna connection terminal electrode () disposed in the inside of outer case (); and an antenna module () having a sheet board () which includes an antenna () disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer () of magnetic substance disposed on the other surface, and an antenna terminal electrode () disposed on the one or the other surface. The antenna module () is overlaid on the mounted module (), and the antenna connection terminal electrode () is connected with the antenna terminal electrode ().

Semiconductor memory module having built-in antenna

An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.

Process and apparatus for flow soldering

A barrier metal layer is provided on at least one of two electrodes, with one formed on a substrate and the other connected to an electronic component, so as to coat a base material of the electrode, which base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Bi, contacting the solder material with the barrier metal layer while the solder material is in a molten state; and solidifying the solder material. Thereby, when the electronic component is soldered to the substrate with the solder material such as an Sn&#x2014;Bi based material or an Sb&#x2014;Ag based material containing Bi, the degradation of a soldering part is avoided, and thus a sufficient thermal fatigue strength of the soldering part is obtained.

Process for soldering and connecting structure

In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle and that of the picked-up component is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette from which the component has been fed is in abnormal condition, as well as the mounting action of the component is stopped.

There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

Method of soldering using lead-free solder and bonded article prepared through soldering by the method

A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material. Molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and the board is thereafter cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.

In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle,and that of the picked-up component,is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette,from which the component,has been fed is in abnormal condition, as well as the mounting action of the component,is stopped.

In a method and a device for mounting an electronic component, a solder paste is printed on lands of a substrate with the use of a mask having a projecting part at a portion facing the substrate and positioned to between neighboring lands, and the projecting part prevents the solder paste on of the neighboring lands from flowing so as to come in contact with a other of the neighboring land to cause a shortcircuit between the neighboring lands.

Method and apparatus for mounting electronic component

A method for mounting on integrated circuit having many leads with narrow pitches on the printed circuit board. In a method, a resist layer is formed between lands on the board, and solder paste is applied with a stencil to the lands so that the positions of the solder paste on the lands are staggered. Then, leads of the integrated circuit are positioned on the lands. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. In a different embodiment, each land includes a first portion and a second portion having a width narrower than the first portion, and the second portions are arranged staggeredly among the lands. Then, solder paste is applied to the first portions having the wider width. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. If solder including bismuth is used, reflow soldering can be performed in ambient environment.

Growing community of inventors

Toyonaka, Japan

Masato Hirano