The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2010

Filed:

Jan. 25, 2005
Applicants:

Masato Mori, Osaka, JP;

Masato Hirano, Osaka, JP;

Hiroaki Onishi, Osaka, JP;

Kiyoshi Nakanishi, Kanagawa, JP;

Akihiko Odani, Kanagawa, JP;

Inventors:

Masato Mori, Osaka, JP;

Masato Hirano, Osaka, JP;

Hiroaki Onishi, Osaka, JP;

Kiyoshi Nakanishi, Kanagawa, JP;

Akihiko Odani, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board includes a substrate including electrode patterns formed thereon, first chip components mounted on the substrate and a second chip component mounted on a side of electrodes of the first chip components opposite from the substrate. The second chip component is bonded at one electrode to an electrode of the first chip component and is also bonded at the other electrode to an electrode of the first chip component. By stacking chip components in plural stages, it is possible to mount chip components with a high density on the substrate, thereby enabling reduction of the size of the circuit board.


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