The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 1999
Filed:
Sep. 04, 1996
Applicant:
Inventors:
Hiroaki Onishi, Higashiosaka, JP;
Masato Hirano, Osaka, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka-fu, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ; B23K / ;
U.S. Cl.
CPC ...
22818021 ; 228215 ; 228 41 ; 118504 ; 427282 ;
Abstract
In a method and a device for mounting an electronic component, a solder paste is printed on lands of a substrate with the use of a mask having a projecting part at a portion facing the substrate and positioned to between neighboring lands, and the projecting part prevents the solder paste on of the neighboring lands from flowing so as to come in contact with a other of the neighboring land to cause a shortcircuit between the neighboring lands.