This inventor holds 17 USPTO granted patents and 2 EPO patents. Top assignees: Shin-Etsu Handotai Co., Ltd., Other. Active years: 1993-2021.
Location History:
- Gunma-ken, JP (2001 - 2003)
- Gunma, JP (1994 - 2007)
- Annaka, JP (1993 - 2021)
Company Filing History:
15 out of 1,099 
2 out of 834,411 Years Active: 1993-2021
Title: Masatake Nakano: Innovator in SOI Wafer Technology
Introduction
Masatake Nakano is a prominent inventor based in Annaka, Japan, known for his significant contributions to the field of semiconductor technology. With a total of 17 patents to his name, Nakano has made remarkable advancements in the production of bonded silicon-on-insulator (SOI) wafers.
Latest Patents
Among his latest patents, Nakano has developed a method for producing bonded SOI wafers. This innovative technique involves bonding a bond wafer and a base wafer, both made of silicon single crystal, with a silicon oxide film placed in between. The process includes preparing a base wafer with specific resistivity and oxygen concentration, forming a silicon oxide film through heat treatment, and thinning the bonded wafer to create an SOI layer. Another notable patent is a method for manufacturing a bonded SOI wafer that prevents single-crystallization of polycrystalline silicon while minimizing warpage of the base wafer. This method enhances the efficiency and reliability of semiconductor devices.
Career Highlights
Throughout his career, Nakano has worked with notable companies, including Shin-Etsu Handotai Co., Ltd. His expertise in semiconductor technology has positioned him as a key figure in the industry, contributing to advancements that have a lasting impact on the field.
Collaborations
Nakano has collaborated with esteemed colleagues such as Kiyoshi Mitani and Masatake Katayama. These partnerships have fostered innovation and have been instrumental in the development of new technologies in the semiconductor sector.
Conclusion
Masatake Nakano's contributions to the field of semiconductor technology, particularly in the area of bonded SOI wafers, highlight his role as a leading inventor. His innovative methods and collaborations continue to influence advancements in the industry.