Masashi Ichikawa

Title: Masashi Ichikawa: Innovator in Wafer Technology

Introduction

Masashi Ichikawa is a prominent inventor based in Nishishirakawa-gun, Japan. He has made significant contributions to the field of semiconductor technology, particularly in wafer manufacturing and evaluation methods. With a total of 5 patents to his name, Ichikawa's work has had a substantial impact on the industry.

Latest Patents

Ichikawa's latest patents include a series of innovative methods and apparatuses related to wafer flatness evaluation. These patents encompass a wafer flatness evaluation method, a wafer flatness evaluation apparatus that implements this method, a wafer manufacturing method utilizing the evaluation method, a wafer quality assurance method based on the evaluation method, and a semiconductor device manufacturing method that employs the evaluation method. The wafer flatness evaluation method involves measuring the front and rear surface shapes of a wafer. The front surface is divided into sites, and a flatness calculating method is selected based on the position of the site being evaluated, allowing for accurate acquisition of flatness in the wafer surface.

Career Highlights

Throughout his career, Ichikawa has worked with notable companies in the semiconductor industry. He has been associated with Shin-Etsu Handotai Co., Ltd. and Toshiba Corporation, where he has contributed to advancements in wafer technology and manufacturing processes.

Collaborations

Ichikawa has collaborated with esteemed colleagues such as Tadahito Fujisawa and Soichi Inoue, further enhancing the innovation and development of semiconductor technologies.

Conclusion

Masashi Ichikawa's contributions to wafer technology and semiconductor manufacturing are noteworthy. His innovative patents and collaborations have significantly advanced the field, making him a respected figure in the industry.