The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2009
Filed:
Feb. 26, 2007
Tadahito Fujisawa, Tokyo, JP;
Soichi Inoue, Yokohama, JP;
Makoto Kobayashi, Nishishirakawa-gun, JP;
Masashi Ichikawa, Nishishirakawa-gun, JP;
Tsuneyuki Hagiwara, Tokyo, JP;
Kenichi Kodama, Mito, JP;
Tadahito Fujisawa, Tokyo, JP;
Soichi Inoue, Yokohama, JP;
Makoto Kobayashi, Nishishirakawa-gun, JP;
Masashi Ichikawa, Nishishirakawa-gun, JP;
Tsuneyuki Hagiwara, Tokyo, JP;
Kenichi Kodama, Mito, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Nikon Corporation, Tokyo, JP;
Abstract
There is disclosed a wafer flatness evaluation method includes measuring front and rear surface shapes of a wafer. The wafer front surface measured is divided into sites. Then, a flatness calculating method is selected according to a position of the site to be evaluated and flatness in the wafer surface is acquired.